3D multicore systems with stacked DRAM have the poten-tial to boost system performance significantly; however, this performance increase may cause 3D systems to exceed the power budget or create thermal hot spots. This paper in-troduces a framework to model on-chip DRAM accesses and analyzes performance, power, and temperature tradeoffs of 3D systems. We propose a runtime optimization policy to maximize performance while maintaining power and ther-mal constraints. Our policy dynamically monitors workload behavior and selects among low-power and turbo operating modes accordingly. Experiments with multithreaded work-loads demonstrate up to 49 % energy efficiency improvements compared to existing thermal management policies
With the popularity of multi-core architecture, to sustain the memory demands from different cores, ...
none4siEnergy efficiency is the major optimization criterion for systems-on-chip (SoCs) for mobile d...
In this model a runtime cache data mapping is discussed for 3-D stacked L2 caches to minimize the ov...
Thesis (Ph.D.)--Boston UniversityMany-core systems, ranging from small-scale many-core processors to...
none5siHeterogeneous 3D integrated systems with Wide- I/O DRAMs are a promising solution to squeeze...
on a multi-core processor has many benefits for the embedded system. Compared with a conventional 2D...
Heterogeneous 3D integrated systems with Wide- I/O DRAMs are a promising solution to squeeze more f...
Heterogeneous 3D integrated systems with Wide- I/O DRAMs are a promising solution to squeeze more f...
Resource pooling, wheremultiple architectural components are shared among cores, is a promising tech...
Continuous semiconductor technology scaling and the rapid increase in computational needs have stimu...
Heterogeneous 3D integrated systems withWide-I/O DRAMs are a promising solution to squeeze more func...
The sustained increase in computational performance demanded by next-generation applications drives ...
3D stacked wafer integration has the potential to improve multipro-cessor system-on-chip (MPSoC) int...
Energy management is a problem of all types of computing devices. For example, short battery life is...
Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlik...
With the popularity of multi-core architecture, to sustain the memory demands from different cores, ...
none4siEnergy efficiency is the major optimization criterion for systems-on-chip (SoCs) for mobile d...
In this model a runtime cache data mapping is discussed for 3-D stacked L2 caches to minimize the ov...
Thesis (Ph.D.)--Boston UniversityMany-core systems, ranging from small-scale many-core processors to...
none5siHeterogeneous 3D integrated systems with Wide- I/O DRAMs are a promising solution to squeeze...
on a multi-core processor has many benefits for the embedded system. Compared with a conventional 2D...
Heterogeneous 3D integrated systems with Wide- I/O DRAMs are a promising solution to squeeze more f...
Heterogeneous 3D integrated systems with Wide- I/O DRAMs are a promising solution to squeeze more f...
Resource pooling, wheremultiple architectural components are shared among cores, is a promising tech...
Continuous semiconductor technology scaling and the rapid increase in computational needs have stimu...
Heterogeneous 3D integrated systems withWide-I/O DRAMs are a promising solution to squeeze more func...
The sustained increase in computational performance demanded by next-generation applications drives ...
3D stacked wafer integration has the potential to improve multipro-cessor system-on-chip (MPSoC) int...
Energy management is a problem of all types of computing devices. For example, short battery life is...
Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlik...
With the popularity of multi-core architecture, to sustain the memory demands from different cores, ...
none4siEnergy efficiency is the major optimization criterion for systems-on-chip (SoCs) for mobile d...
In this model a runtime cache data mapping is discussed for 3-D stacked L2 caches to minimize the ov...